Back to Events
Calls for Submission

Call: PerCom 2023

Friday, September 16, 2022 to Monday, October 3, 2022

Event Details

The 21th International Conference on Pervasive Computing and
Communications (PerCom 2023), March 13-17, 2023
Atlanta, USA

Call for Papers

*Important Dates*
Paper registration in EDAS: September 26, 2022

Submission via EDAS: October 3, 2022
Notification: December 22, 2022

IEEE PerCom, now in its 21st year, will be held in Atlanta, Georgia (USA), during March 13-17, 2023, as a physical event, with a provision for remote participation.  PerCom is the premier annual scholarly venue in pervasive computing and communications. Pervasive computing is constantly at the forefront of mobile systems research, and has found its way into many commercial systems due to tremendous advances in a broad spectrum of technologies and topics such as wireless networking, mobile and distributed computing, sensor systems, ambient intelligence, and smart devices.

PerCom 2023 solicits research contributions in all areas pertinent to pervasive computing and communications, especially those that cross traditional research boundaries. In particular, we target:

Advances in pervasive systems and infrastructures: middleware systems and services; data engineering for pervasive computing; cloud, fog and edge computing; integrations of smartphones in pervasive experiences; applications of device-to-device coordination.

Theories, models, and algorithms: context modeling and reasoning; adaptive computing; activity and emotion recognition; programming paradigms; applied machine learning; deep machine learning; federated learning; causal learning; cognitive computing; complex networks; spatio-temporal modeling techniques.

Domain-specific challenges and novel applications: urban/mobile crowdsensing & intelligence; PerCom for healthcare and well-being; cyber-physical PerCom; smart homes and virtual assistants; mixed reality; sports analytics; crime prevention; pervasive nowcasting; urban robotics; pervasive AR/VR;  smart vehicles; disaster sensing and management.

Intersections of PerCom with: opportunistic networks; IoT and sensor systems; RFID systems; pervasive data science, cyber physical systems, 3D networks.

New techniques for user-level concerns: participatory and social sensing; trust, security, privacy, and ethics; user interface, interaction, and persuasion; online and offline social networking and pervasive computing.

Technological innovations: architectures, protocols, and technologies for pervasive communications; energy-harvesting, self-powered, or battery-less systems; mobile and wearable systems; smart devices and environments; positioning, navigation, timing,  and tracking technologies; device-free human sensing.

Contributions can be analytical, empirical, technological, methodological, or a combination. Papers reporting strong systems engineering contributions backed by solid and appropriate evaluations are strongly encouraged. The impact of the contributions should be demonstrated in the context of pervasive computing and communications applications.


Paper submission must be done for the main conference and all associated events via EDAS. If you do not have an EDAS account, please, register first (it’s free) via the following link: register. The direct submission link for PerCom 2023 is here.

PerCom 2023 will follow a double-blind review process. As a result, authors must make a good faith effort to anonymize their submissions.

In particular, as in previous PerCom editions, publishing pre-prints of your submitted papers in online archives (e.g., arXiv) prior to submission does NOT disqualify the paper from consideration at PerCom. Moreover, we instruct reviewers NOT to go searching for pre-prints of submitted papers.

Submitted papers must be unpublished and not considered elsewhere for publication. Also, they must show a significant relevance to pervasive computing and communications. Submitted papers will undergo a rigorous review process handled by the Technical Program Committee. Only electronic submissions in PDF format will be considered.

The IEEE LaTeX and Microsoft Word templates, as well as formatting instructions, can be found here. Papers must be at most 9 pages of technical content (10pt font, 2-column format), including text, figures, and tables and up to one additional page for references only.

Accepted papers will be published in IEEE Xplore. All accepted papers will be invited to submit an associated artifact abstract providing the code, data, results, etc. associated with the contribution.

The best paper will receive the prestigious Mark Weiser Best Paper Award.

Selected papers will be invited to submit extended versions for a special issue of the Pervasive and Mobile Computing Journal.

Franco Zambonelli, TPC chair, Università di Modena e Reggio Emilia, Italy
Seng Loke, TPC Vice Chair, Deakin University, Australia
Eirini Eleni Tsiropoulou, TPC Vice Chair, University of New Mexico, USA
Juan Ye, TPC Vice Chair, St. Andrews University, UK